Macro of IBM 4 MByte memory chip wafer

Macro of IBM 4 MByte memory chip wafer

T370/0584 Rights Managed

Request low-res file

530 pixels on longest edge, unwatermarked

Request/Download high-res file

Uncompressed file size: 32.2MB

Downloadable file size: 2.2MB

Price image Pricing

Please login to use the price calculator


Caption: Macrophoto of a wafer of individual IBM 4 Megabyte (Mb) memory chips (integrated circuits). Individual integrated circuits (chips) are made from circular wafers, initially cut from a cylinder of pure semiconductor material such as silicon or gallium arsenide. The complex pattern of circuits that comprises each chip is built-up in a series of processes involving masks, deposition of insulators and etchings. Finished chips are eventually diced from the wafer prior to packaging.

Release details: Model release not required. Property release not required.

Keywords: chip, electronic, electronics, high-tech, ibm 4mbyte memory, ibm memory chip, integrated circuit, memory chip, microchip, on wafer, technology, wafer

Licence fees: A licence fee will be charged for any media (low or high resolution) used in your project.