MEMS production, flip chip bonding

MEMS production, flip chip bonding

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Credit: COLIN CUTHBERT/SCIENCE PHOTO LIBRARY

Caption: MEMS production. Flip chip bonding apparatus (lower right) being used to mount MEMS (microelectromechanical systems) devices. MEMS devices are constructed on a microscopic scale using technologies such as wet and dry etching and thin film deposition. Applications include sensors and optical displays. Materials used to construct MEMS devices include silicon and polymers such as plastics. Photographed at an INEX facility. INEX is a British microsystems and nanotechnology company that was founded in 2002.

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