MEMS production, wafer cutting

MEMS production, wafer cutting

T395/0322

Rights Managed

Caption

MEMS production. Machine being used to cut up a silicon wafer of MEMS (microelectromechanical systems) devices. The liquid provides lubrication during the cutting process. MEMS devices are constructed on a microscopic scale using technologies such as wet and dry etching and thin film deposition. Applications include sensors and optical displays. Materials used to construct MEMS devices include silicon and polymers such as plastics. Photographed at an INEX facility. INEX is a British microsystems and nanotechnology company that was founded in 2002.

Release details

Model release not required. Property release not required.

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