MEMS production, solder examination

MEMS production, solder examination

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Credit: COLIN CUTHBERT/SCIENCE PHOTO LIBRARY

Caption: MEMS production. Clean room technician using a scanning electron microscope to carry out 'solder bump analysis' on a MEMS (microelectromechanical systems) device. The bumps of solder, a bonding material, are seen on the screen. MEMS devices are constructed on a microscopic scale using technologies such as wet and dry etching and thin film deposition. Applications include sensors and optical displays. Materials used to construct MEMS devices include silicon and polymers such as plastics. Due to their small size, microscopes have to be used to examine and handle MEMS devices. Photographed at an INEX facility. INEX is a British microsystems and nanotechnology company that was founded in 2002.

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