Silicon wafer production, artwork

Silicon wafer production, artwork

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This image is part of the sequence science and technology: silicon wafer production

Credit: CHRISTIAN KOCH, MICROCHEMICALS/SCIENCE PHOTO LIBRARY

Caption: Silicon wafer production. Artwork showing the apparatus used to slice ultra-thin silicon wafers from an ingot (rod-shaped, blue). Silicon used in microchips needs to be precisely engineered for structure and purity. These wafers are machined from a large single-crystal ingot grown from high-grade polycrystalline silicon. The silicon is doped to produce a semiconductor with the required properties. Slicing is done with a diamond saw. Each wafer is 15-20 centimetres across and 250-600 micrometres thick. The insets (bottom) show close-ups of the slicing process. The wafers are then polished, oxidised and etched.

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Keywords: artwork, crystalline silicon, cut, cutting, diagram, diamond saw, electronics, engineering, factory, illustration, industrial, industry, ingot, inset, insets, manufacture, manufacturing, materials science, microscopic, process, producing, production, rolling saw, saw, semiconducting, semiconductor, silicon wafer, slice, slices, slicing, stage, stages, technological, technology, thin, ultra-thin, wafers, white background

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