3D chip stack, IBM research

3D chip stack, IBM research

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Caption: 3D chip stack, IBM research. IBM scientist Bruno Michel in his laboratory at IBM Research-Zurich, Switzerland. He is manager of the Advanced Thermal Packaging group, which has pioneered energy-efficient methods of using hot water for cooling, as well as the concept of data centres with zero emissions (environmental impact). The research also includes liquid cooling for 3D chip stacks. 3D chips are a potential method to boost performance and energy efficiency. Photographed in February 2006.

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