3D chip stack, IBM research

3D chip stack, IBM research

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Caption: 3D chip stack, IBM research. 3D chip with interlayer water cooling at IBM Research-Zurich, Switzerland. This research involves the use of liquid cooling for 3D chip stacks, a potential method to boost performance and energy efficiency. It is thought that by 2025, chip stacks with embedded liquid cooling, communications in three dimensions, and minimal power consumption will shrink supercomputers to the size of a desktop computer. Photographed in March 2011.

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