Microchip processor heat sink

Microchip processor heat sink

C002/8935 Rights Managed

Request low-res file

530 pixels on longest edge, unwatermarked

Request/Download high-res file

Uncompressed file size: 50.1MB

Downloadable file size: 1.5MB

Price image Pricing

Please login to use the price calculator


Caption: Microchip processor heat sink (centre), seen against a circuit board background. This metal heat sink was produced by extrusion, and has three rows of fins either side. It is designed to remove the heat generated by a CPU (central processing unit) microchip, to which it would be attached. The finned surface increases the area in contact with the surrounding air, making the heat exchange more efficient and lowering the temperature of the CPU.

Release details: Model release not available. Property release not required.

Keywords: 1, air-cooled, central processing unit, chipset, circuit board, component, components, computer, computing, cooling, cooling unit, cpu, electronics, extruded, heat exchanger, heat plate, heat sink, heatsink, metal, microchip, microprocessor, one, pcb, printed circuit board, silicon chip, single, technological, technology, thermal contact

Licence fees: A licence fee will be charged for any media (low or high resolution) used in your project.