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Glass & silicon wafers for making pressure sensors

Glass & silicon wafers for making pressure sensors

T358/0063

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Credit

JAMES HOLMES / FULMER RESEARCH / SCIENCE PHOTO LIBRARY JAMES HOLMES / FULMER RESEARCH / SCIENCE PHOTO LIBRARY

Caption

Glass & silicon wafers used in the manufacture of ultra-sensitive pressure sensors. The wafers will be bonded together to form around 200 tiny sensors, each one composed of a layer of glass & a layer of silicon, with a tiny vacuum-filled chamber sandwiched between them. One terminal of the sensor is connected to the silicon & the other to a metal electrode bonded to the glass floor of the chamber. Changes in pressure alter the chamber height & hence the electrical capacitance of the device, allowing it to be calibrated to measure pressure. The sensor is a mechanical device & does not contain integrated circuits or transistors.

Release details

Model release not required. Property release not required.

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