DAVID PARKER / SCIENCE PHOTO LIBRARY DAVID PARKER / SCIENCE PHOTO LIBRARY
Light micrograph showing a junction (red X-shaped lanes) between four 16K 4116 memory integrated circuits (chips). The junctions, known as scribe lanes, form a gridlike pattern on the wafer separating the chips. They are also the path taken by a diamond scribe to cut free, or dice, the individual chips. The large squares on the edge of the chips are bonding pads, made from an aluminium alloy. The marks appearing on them are caused by a test probe, which checks the viability of the chip. At a later stage, the bonding stage, connectors (carrying the voltage), will be soldered onto these pads.
Model release not required. Property release not required.