This image is not available for purchase in your country.

Semiconductor wafer

Semiconductor wafer

T370/0533

Rights Managed

This image is not available for purchase in your country.

Please contact your Account Manager if you have any query.

Credit

MANFRED KAGE / SCIENCE PHOTO LIBRARY MANFRED KAGE / SCIENCE PHOTO LIBRARY

Caption

A single circular semiconductor wafer, comprised of numerous individual Siemens 4 Megabyte (Mb) integrated circuits that will ultimately be used as computer memory devices. Individual integrated circuits (chips) are made from circular wafers, initially cut from a cylinder of semiconductor material such as silicon or gallium arsenide. The complex pattern of circuits that comprises each chip is built-up in a series of processes involving masks, deposition of insulators and etchings. Finished chips are eventually diced from the wafer prior to packaging.

Release details

Model release not required. Property release not required.

 {{ i.shot_duration ? i.shot_duration + ' ' : '' }}{{ i.shot_uhd ? '4K ' : i.hires ? 'HD ' : '' }}{{ i.spl_number }} R{{ i.license }}

  • Add to board
  • Similar {{ mediaType(i) }}