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Macro of IBM 4 MByte memory chip wafer

Macro of IBM 4 MByte memory chip wafer

T370/0584

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Credit

MANFRED KAGE / SCIENCE PHOTO LIBRARY MANFRED KAGE / SCIENCE PHOTO LIBRARY

Caption

Macrophoto of a wafer of individual IBM 4 Megabyte (Mb) memory chips (integrated circuits). Individual integrated circuits (chips) are made from circular wafers, initially cut from a cylinder of pure semiconductor material such as silicon or gallium arsenide. The complex pattern of circuits that comprises each chip is built-up in a series of processes involving masks, deposition of insulators and etchings. Finished chips are eventually diced from the wafer prior to packaging.

Release details

Model release not required. Property release not required.

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