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Silicon chip autobonding

Silicon chip autobonding

T380/0099

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Credit

DAVID PARKER / SEAGATE MICROELECTRONICS LTD / SCIENCE PHOTO LIBRARY DAVID PARKER / SEAGATE MICROELECTRONICS LTD / SCIENCE PHOTO LIBRARY

Caption

Technician using a light microscope in the autobonding stage of fabrication of integrated circuits (silicon chips). Autobonding refers to the attachment of wire leads from pads around the rectangular chip to the surrounding lead frame - part of the chip's packaging which houses the pins that connect to a circuit board. Tweezers are used in this delicate operation, an image of which appears on the monitor at top. Photographed at the.

Release details

Model release not available. Property release not required.

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