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Autobonding stage on silicon chip

Autobonding stage on silicon chip

T380/0101

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Credit

DAVID PARKER / SEAGATE MICROELECTRONICS LTD / SCIENCE PHOTO LIBRARY DAVID PARKER / SEAGATE MICROELECTRONICS LTD / SCIENCE PHOTO LIBRARY

Caption

Technician using tweezers to position the wire leads used in the autobonding stage of fabrication of integrated circuits (silicon chips). Autobonding refers to the attachment of wire leads from pads around the rectangular chip to the surrounding lead frame - part of the chip's packaging which houses the pins that connect to a circuit board. The unbonded circuits (visible below the tweezers) are mounted on a microscope stage during autobonding; a television camera mounted over the microscope displays the delicate operation. Photographed at Seagate Microelectronics Ltd., Livingston, Scotland.

Release details

Model release not available. Property release not required.

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