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Failure analysis test equipment

Failure analysis test equipment

T750/0059

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Credit

ANDREW BROOKES, NATIONAL PHYSICAL LABORATORY / SCIENCE PHOTO LIBRARY ANDREW BROOKES, NATIONAL PHYSICAL LABORATORY / SCIENCE PHOTO LIBRARY

Caption

Failure analysis test equipment. This equipment is used for the tensile and dynamic modulus testing of materials. The tensile modulus (or Young's modulus) defines a material's stiffness and is defined as the ratio of stress to strain in the region in which Hooke's Law is obeyed for the material (before it becomes deformed). Dynamic modulus is the ratio of stress to strain under vibratory conditions.

Release details

Model release not required. Property release not required.

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