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3D chip stack, IBM research

3D chip stack, IBM research

C022/8444

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Credit

IBM RESEARCH / SCIENCE PHOTO LIBRARY IBM RESEARCH / SCIENCE PHOTO LIBRARY

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Caption

IBM research. IBM scientist Bruno Michel in his laboratory at IBM Research-Zurich, Switzerland. He is manager of the Advanced Thermal Packaging group, which has pioneered energy-efficient methods of using hot water for cooling, as well as the concept of data centres with zero emissions (environmental impact). The research also includes liquid cooling for 3D chip stacks. Photographed in February 2006.

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