This image is not available for purchase in your country.

3D chip stack, IBM research

3D chip stack, IBM research

C022/8447

Rights Managed

This image is not available for purchase in your country.

Please contact your Account Manager if you have any query.

Credit

IBM RESEARCH / SCIENCE PHOTO LIBRARY IBM RESEARCH / SCIENCE PHOTO LIBRARY

Caption

IBM research. IBM Research-Zurich, Switzerland. This research involves the use of liquid cooling for 3D chip stacks, a potential method to boost performance and energy efficiency. It is thought that by 2025, chip stacks with embedded liquid cooling, communications in three dimensions, and minimal power consumption will shrink supercomputers to the size of a desktop computer. Photographed in March 2011.

Release details

Model release not required. Property release not required.

 {{ i.shot_duration ? i.shot_duration + ' ' : '' }}{{ i.shot_uhd ? '4K ' : i.hires ? 'HD ' : '' }}{{ i.spl_number }} R{{ i.license }}

  • Add to board
  • Similar {{ mediaType(i) }}